Standards are defined by OTMK “new construction in every project”. At OTMK, standards are the wheel for continuous improvement that is time-tuned.
Our team of engineers will support you in creating reel-to-reel electroplating line that are individually tailored to your needs.
We speak the same language as our partners in the areas of quality (ISO9001, IAF16949, CQI), mechanical engineering, process chain, chemistry and automation.
In continuous systems for cleaning, polishing and finishing strips and stamped products, we design the strip electroplating systems according to product requirements.
OTMK GmbH emerged from a group company with over 100 customers who receive our services. We specialize in the sectors of mechanical and plant engineering, robotics, assembly, automation and control technology.
We started early and built our technical center (technology center). Here we define your process with our know-how with immediately measurable results.
We plan the process for your needs with a complete solution of machines, spare parts and automation/robots. We attach great importance to quality product manufacturing and innovative automation. You've come to the right place here.
Technology for loose part selective plating.
CSP (Conector Selective Plating) is a full automation line for selective plating, high quality and for loose part with high volume.
Plant properties: Homogeneous layer, low precious metal consumption, full automation.
Rack Plating Line with Robotic Handling
We build Plating Lines as Reel-to-Reel Plating or Rack Plating Line with Robotics Handling.
BBP (Busbar Plating) Technology for Busbar loose part selective plating.
BBP is a line for selective plating, high quality, loose part with high volume.
Plant properties: Homogeneous layer, low precious metal consumption, full automation.
OTMK supplies for the connector market techniques to improve your plating process on selectivity, productivity and flexibility.
In standard base mateiral copper and nickel finishes are usually applied by all over plating.
The more precious metals like silver, gold or paladium are selective plated on only the functional areas of the connector by a number of different techniques like spot plating, control depth plating or stripe plating.
In addition the solder finish area of the connector is plated by control depth plating.
OTMK suppplies for Semicon Wafer, Packaging, Leadfram markes techniques plating line
All are systems is fully customized to your specific needs and with a green solution.
OTMK CPL/EPL are designed with more innovation parameters and are capable of handling any kind of products.
The size up to 120 x 400 mm can easily be handled on the Plating Line
OTMK supplies for Wire markes Wire Plating Line techniques with copper, nickel, tin, silver and gold.
Our techniques for wire plating line with copper, nickel, tin, silver and gold is by flexibility, productivity and safty.
The machine speed a from 5m/min. to 1.000m/min.
